We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Circuit Board Manufacturing.
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Circuit Board Manufacturing Product List and Ranking from 17 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

Circuit Board Manufacturing Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. ウイル Osaka//Electronic Components and Semiconductors
  2. 伸和プリント工業 Tokyo//Manufacturing and processing contract
  3. 東洋精密工業 Nara//Electronic Components and Semiconductors
  4. 4 ピーダブルビー 草津事業所 Shiga//Industrial Electrical Equipment
  5. 4 サーテック フレキ基板（FPC）ソフトウェア ハードウェア 成膜加工 基板設計 Shizuoka//Electronic Components and Semiconductors
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Circuit Board Manufacturing Product ranking

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. Manufacturing of stack build-up substrates (6-layer substrates, 8-layer substrates, 10-layer substrates) ウイル
  2. Shinwa Print Industry - Printed Circuit Board Manufacturing 伸和プリント工業
  3. Ultra-fine circuit formation (fine pitch/fine pattern) サーテック フレキ基板（FPC）ソフトウェア ハードウェア 成膜加工 基板設計
  4. PCB substrate manufacturing (substrate assembly can also be handled within the group) UIGREEN
  5. 4 High-frequency substrate manufacturing ピーダブルビー 草津事業所

Circuit Board Manufacturing Product List

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[Case Study of Circuit Board Manufacturing] Thick Film Circuit Board

[Case Study of Circuit Board Manufacturing] Thick Film Circuit Board

We can also accommodate large lots! We are willing to take on processing for irregular materials and special conditions.

This is a manufacturing example of thick film circuit boards processed using screen printing technology. Compared to thin film circuit boards, they are cost-effective and can accommodate large production runs. Based on our past achievements, we will select screens and pastes and propose suitable specifications to meet your requirements. We also challenge ourselves to process irregular materials and special conditions. 【Case Overview】 ■Materials: Alumina, aluminum nitride, glass, metal materials, resin materials, etc. ■Types of paste: Au, Ag, Ag/Pd, Ag/Pt, glass, solder resist, polyimide ink, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Circuit board design and manufacturing

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Substrate manufacturing

Substrate manufacturing

We propose suitable printed circuit boards for our customers! We support everything from prototypes and small lots to mass production.

At K-Oll, we conduct "circuit board manufacturing" through our partner companies. Orders are placed according to each company's strengths and customer requests, such as low cost and short delivery times. We propose suitable manufacturing plans taking into account the schedule for repeat production. We have a wide range of partners, from flexible board manufacturers that excel in small-lot prototypes to those capable of mass production. 【Features】 ■ Numerous partner companies through our network since establishment ■ Orders placed according to each company's strengths and customer requests, such as low cost and short delivery times ■ We propose suitable manufacturing plans considering the schedule for repeat production *For more details, please refer to the PDF document or feel free to contact us.

  • Contract manufacturing

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Substrate manufacturing

Substrate manufacturing

Now, printed circuit boards have become high-function modular components, enabling us to provide products that meet our customers' advanced requirements.

We are capable of manufacturing everything from thin multi-layer substrates to thick high multi-layer substrates, and we also accommodate rapid prototyping from a single piece as well as production from small to large lots. Among these, the semiconductor tester boards represent the culmination of our long-standing expertise in substrate manufacturing, with technology applied to fine patterns, high multi-layer, high aspect ratio plating, impedance control, and the production of low dielectric constant materials.

  • Contract manufacturing

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Shinwa Print Industry - Printed Circuit Board Manufacturing

Shinwa Print Industry - Printed Circuit Board Manufacturing

We are a handy service for printed circuit boards.

We manufacture general printed circuit boards. We also accept special requests. Please feel free to contact us. We are UL certified. *For details, please contact our sales department.

  • Other contract services

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Toshiba Computer Technology Corporation - Circuit Board Manufacturing

Toshiba Computer Technology Corporation - Circuit Board Manufacturing

As a key player in the manufacturing and maintenance of electronic devices that support the accelerating digital network society.

Utilizing the latest technologies and high skills developed in personal computer manufacturing, we support the construction of setup assistance systems that accommodate small-lot production of various types, enabling us to handle a wide range of manufacturing from prototype boards to mass production boards with high quality.

  • Circuit board design and manufacturing

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NAX Engineering Circuit Board Manufacturing

NAX Engineering Circuit Board Manufacturing

Short delivery time, low price, high quality.

We can handle a wide range of applications from experimental and prototype single-sided to product-level mass production of multilayer boards.

  • others

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Ultra-fine circuit formation (fine pitch/fine pattern)

Ultra-fine circuit formation (fine pitch/fine pattern)

Ultrafine circuit formation (fine pitch/fine pattern)

Our company offers proposals for the prototyping and mass production of flexible substrates, not only through etching and plating technologies for printed circuit boards but also through various thin film deposition processes for metal conductors using vacuum deposition and sputtering techniques, applying technologies across different industries. We support not only circuit formation using subtractive methods but also fine wiring with the Modified Semi-Additive Process (MSAP). Primarily focusing on circuit formation on flexible substrates such as transparent flexible substrates, we also provide patterning processes for glass, film ITO, and metal films, combining thin film formation technology, etching technology, and plating technology in our proposals. Additionally, we accommodate fine pattern processing for the formation of micro and narrow pitch bumps, as well as redistribution layers (RDL) for wafer-level packages (WLP).

  • Processing Contract
  • Circuit board design and manufacturing
  • EMS

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Comprehensive support from design to circuit board manufacturing and assembly for industrial electronic equipment components!

Comprehensive support from design to circuit board manufacturing and assembly for industrial electronic equipment components!

From a single prototype to medium volume and implementation, you can trust us with your circuit board needs.

Our company conducts integrated production of circuit board design and manufacturing for electronic devices, such as electronic circuit boards, at our own factory. We accommodate everything from single prototypes to medium-scale production and assembly. We also manufacture multilayer boards. With our ISO9001 certified quality assurance system, we meet a wide range of needs. 【Product Line】 ■ Surface treatment, lead-free solder, gold, copper, and eutectic solder ■ EMC measures implemented through pattern design ■ High current and heat dissipation boards with a copper foil thickness of 1mm ■ Special large boards with a width of 1,200mm *For more details, please feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board

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Substrate manufacturing

Substrate manufacturing

We offer a wide variety of high-performance FR-4 BT resins and materials such as Rogers!

We propose various substrate materials and suitable substrate manufacturing and assembly methods according to the substrate specifications and production quantities. We have experience with high multilayer, IVH, and BVH, so we can accommodate various specifications for internal vias upon consultation. If you have any questions about other materials or manufacturing specifications, please feel free to contact us. 【Handling Materials (Partial)】 ■ FR-4 CEM3 High Thermal Conductivity CEM3 ■ R-5775 (MEGTRON6) ■ FR-5 Equivalent (High Heat Resistance / High Elasticity / Low Thermal Expansion) ■ Hybrid Configuration ■ Ultra-thin / Flexible Multilayer *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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6-layer 14-layer rigid-flex circuit board metal core (aluminum) board manufacturing

6-layer 14-layer rigid-flex circuit board metal core (aluminum) board manufacturing

★Competitive pricing★ We always provide layouts and wiring with EMI resistance in mind, using environmentally friendly materials★ High quality, low price, and a wide variety★

Our company is engaged in the development, design, prototyping, and mass production of printed circuit boards. We consistently respond to speed, quality, and cost from the customer's perspective, achieving competitive costs and production capacity by utilizing overseas factories. Additionally, we provide satisfactory quality for a wide range of boards, from general circuit board designs to high-density multilayer boards, COB, SMT, and other high-difficulty boards. 【Product Lineup】 ■ Single-sided boards ■ 2-layer stack build-up boards ■ Double-sided through-hole boards ■ Build-up boards ■ 6-layer through-hole boards, etc. *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board

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Manufacturing of printed circuit boards and thermal head boards (sensor boards).

Manufacturing of printed circuit boards and thermal head boards (sensor boards).

★Competitive pricing★ We always provide layouts and wiring that consider EMI resistance using environmentally friendly materials★ High quality, low price, and a wide variety★

Our company develops, designs, prototypes, and mass-produces printed circuit boards. We consistently respond to speed, quality, and cost from the customer's perspective, achieving competitive costs and production capacity by utilizing overseas factories. Additionally, we provide satisfactory quality for a wide range of boards, from general circuit board designs to high-density multilayer boards, COB, SMT, and other high-difficulty boards. 【Product Lineup】 ■ Single-sided boards ■ 2-layer stack build-up boards ■ Double-sided through-hole boards ■ Build-up boards ■ 6-layer through-hole boards, etc. *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board

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Manufacturing of thick copper substrates

Manufacturing of thick copper substrates

Manufacturing high-quality, low-cost thick copper substrates based on over 40 years of know-how. Supports copper thickness from 70μm to 140μm.

Our company has a history of over 40 years in the manufacturing of printed circuit boards. We also produce "thick copper boards" that accommodate copper thicknesses ranging from 70μm to 140μm for power supply manufacturers, providing high-quality and low-cost boards. We can flexibly respond to requests from prototyping to mass production. Since the president is also an engineer, we can support technical consultations regarding design and manufacturing. 【Features】 ■ A system that can comprehensively handle everything from prototyping to mass production ■ Capable of accommodating various thick copper boards, including those using special materials and 40-ounce thicknesses inside and outside the thick copper boards ■ Flexible response to requests for specification changes ■ ISO9001 and ISO14001 certifications obtained *For more details, please refer to the materials. Feel free to contact us with any inquiries.

  • Circuit board design and manufacturing

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PCB substrate manufacturing (substrate assembly can also be handled within the group)

PCB substrate manufacturing (substrate assembly can also be handled within the group)

[Printed Circuit Board Manufacturing] We can also accommodate large and irregularly shaped boards! We have obtained standards for automotive and medical applications and have manufacturing achievements across various industries.

Our manufacturing equipment is well-equipped, allowing us to handle the production of special substrates such as large substrates and irregularly shaped substrates, which are considered difficult by other companies! We have manufacturing achievements in various industries including automotive, medical, home appliances, industrial equipment, and LCDs. Additionally, we also handle substrate mounting within our group, so please feel free to consult us. (We manage everything from component purchasing to substrate mounting within the group.) Examples of manufacturing achievements: - FR4 substrates for projectors - FR4 substrates for industrial robots - FR4 substrates for 5G wireless base stations - FR4 substrates for LCD modules - FR4 substrates for automotive air conditioning control - FR4 substrates for automotive EV battery charging equipment - Substrates for automotive headlight control - FR4 substrates for automotive EV battery charging - Substrates for automotive headlight control - FR4 substrates for automotive headlight control *For more details, please feel free to contact us or download the PDF materials.

  • Printed Circuit Board

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[Circuit Board Manufacturing Example] Thin Film Circuit Board (Thick Copper Specification)

[Circuit Board Manufacturing Example] Thin Film Circuit Board (Thick Copper Specification)

It is possible to form copper electrode patterns with a thickness of approximately 100um in fine pitch!

This is an introduction to a manufacturing case where thick copper patterns were formed on ceramic substrates to meet the needs of high current and high heat dissipation. By using a thin film process, it is possible to create copper electrode patterns with a thickness of approximately 100um in fine pitch. Please feel free to consult us when needed. 【Case Overview】 ■Material: Alumina, Aluminum Nitride ■Film Structure: Ti/Cu/Ni/Au ■Copper Thickness: up to 100um ■L/S: 120/120 (Copper thickness 100um) *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Circuit board design and manufacturing

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High-frequency substrate manufacturing

High-frequency substrate manufacturing

For millimeter wave high-frequency substrates, please contact us for PWB.

- Substrate materials: measures against dielectric loss / measures against resistive loss - Substrate manufacturing: high-precision substrate manufacturing / support for special specifications / pattern finish measurement - Assembly: high-density assembly / special assembly In relation to millimeter-wave high frequency, we can provide consistent support from substrate design to manufacturing and assembly.

  • Circuit board design and manufacturing

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